| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element having connection of a high lifetime reliability connection by using tin-based solder and a semiconductor device having a high lifetime reliability. SOLUTION: A semiconductor element 10 connected to a conductive member 7 by using tin-based solder 8 is provided. A silicide layer 2S, a first metal layer 3 formed of titanium, a second metal layer 4 formed of antimony, and a third metal layer 5 having nickel and/or copper are sequentially laminated on a connection surface to the conductive member 7 of a base material 1 formed of a semiconductor material from a base material 1 side. COPYRIGHT: (C)2011,JPO&INPIT |
