| 摘要 |
An abrasive article referred to as composite polishing pad (CPP) includes a plurality of fixed abrasive elements or a plurality of chemical mechanical polishing (CMP) pads attached to a plurality of pressure pads suspended to flexible structures capable to follow the wafer topography. A plurality of stems with dimpled ends act on the pressure pads to generate desired pressure acting on the wafer. The stems are attached to a spring arrangement capable of substantial vertical deflection under a desired load. In one embodiment a plurality of pressure pads suspended to a plurality of stems by revolute joints. The stems are attached to a spring arrangement capable of substantial vertical deflection under a desired load. In another embodiment, a plurality of pressure pads are attached to a plurality of stems suspended to a series of springs capable of substantial vertical deflection under a desired load.
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