发明名称 CHEMICAL AMPLIFICATION RESIST COMPOSITION, AND MOLD PREPARATION METHOD AND RESIST FILM USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a chemical amplification resist composition to be used for the preparation of a mold, capable of forming a pattern excellent not only in sensitivity and resolution, but also in the line width roughness (LWR) performance, in preparation of a mold. <P>SOLUTION: The chemical amplification resist composition contains a resin which is decomposed by an action of a specified acid to increase the solubility with an alkali developing solution, and a mold preparation method and a resist film each using the composition are also disclosed. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011186418(A) 申请公布日期 2011.09.22
申请号 JP20100142062 申请日期 2010.06.22
申请人 FUJIFILM CORP 发明人 FUJIMORI TORU;SHIRAKAWA KOJI;USA TOSHIHIRO;SUGIYAMA KENJI;ITO TAKAYUKI;TSUBAKI HIDEAKI;NISHIMAKI KATSUHIRO;HIRANO SHUJI;TAKAHASHI HIDETOMO
分类号 G03F7/039;C08F20/10;G03F7/004;G03F7/40;H01L21/027 主分类号 G03F7/039
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