| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve heat dissipation of a light emitting device 1 where a light emitting element 6 is sealed. <P>SOLUTION: The light emitting device includes: a glass substrate 4 where a hollow 2 is formed on a surface; a lead frame 5a which is bonded to the glass substrate 4 and has a part exposed to a side of the glass substrate 4, a bottom face T of the hollow 2 and a rear face R opposite to the surface H of the glass substrate 4; the light emitting element 6 mounted on the exposed lead frame 5a of the bottom face T of the hollow 2; and a sealing material 8 covering the light emitting element 6. A copper material 7 formed of copper or coppery alloy is embedded from the bottom face T of the exposed hollow 2 to the rear face R of the glass substrate 4 in the lead frame 5. <P>COPYRIGHT: (C)2011,JPO&INPIT |
