| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board having a low resistance and a high connection reliability, which eliminates the failure to bond an inner layer core substrate and a prepreg sheet, and the whitening inside the multilayer printed wiring board in appearance. SOLUTION: The multilayer printed wiring board includes: an inner layer core substrate in which a pattern for preventing resin streak is formed in the vicinity of a power source, the ground or an antenna circuit; and the prepreg sheet having an interlayer conduct hole formed by filling a through-hole with a conductive paste. The inner layer core substrate and the prepreg sheet are laminated and thermally pressed to manufacture the multilayer printed wiring board. COPYRIGHT: (C)2011,JPO&INPIT |
