发明名称 SUBSTRATE STICKING DEVICE, SUBSTRATE STICKING METHOD, LAMINATED SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND LAMINATED SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To correct a position shift caused by a substrate position detection mechanism. SOLUTION: The laminated semiconductor device includes: a body; a first stage which has a holding plane for holding a first substrate, and is inhibited from moving to the body in a plane direction of the holding plane, the holding lane being inclined; a second stage which has a holding plane for holding a second substrate, is arranged opposite to the first stage, and moves to the body; and a position correction section which corrects a position of the second substrate in a plane direction at the second stage according to an inclination amount by which the holding plane of the first stage is inclined by making the second substrate abut against the first substrate. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011187707(A) 申请公布日期 2011.09.22
申请号 JP20100051791 申请日期 2010.03.09
申请人 NIKON CORP 发明人 KITO YOSHIAKI
分类号 H01L21/02 主分类号 H01L21/02
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