Heat radiating package substrate and fabricating method the same,申请号KR20090058414-传众专利搜索

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发明名称	Heat radiating package substrate and fabricating method the same
摘要
申请公布号	KR101067128(B1)	申请公布日期	2011.09.22
申请号	KR20090058414	申请日期	2009.06.29
申请人		发明人
分类号	H01L23/34	主分类号	H01L23/34
代理机构		代理人
主权项
地址

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