| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the size of a mountable chip in a semiconductor device. <P>SOLUTION: This semiconductor device includes: a tab 1b mounted with a semiconductor chip 2; a sealing part 3 formed by resin-sealing the semiconductor chip 2; a plurality of leads 1a each having a mounting object surface 1d exposed at the peripheral part of the rear surface 3a of the sealing part 3, and a sealing part forming surface 1g arranged on the side opposite thereto; and wires 4 which connect the pads 2a of the semiconductor chip 2 to the leads 1a. Within the plurality of leads 1a, the length (M) between the inside ends 1h of the sealing part forming surface 1g in the leads 1a arranged oppositely to each other is formed to be longer than the length (L) between the inside ends 1h of the mounting object surface 1d. Thereby, the chip mounting region formed by being surrounded by the inside end parts 1h of the sealing part forming surface 1g of each of the leads 1a can be expanded, so that the size of a mountable chip can be increased. <P>COPYRIGHT: (C)2011,JPO&INPIT |
