发明名称 METHOD FOR MANUFACTURING CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTING TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a conductive connecting material having a laminate structure of a resin composition layer containing a resin component and a metal layer, which enables excellent electric connection between connecting terminals opposing each other and high insulation reliability between adjacent terminals. SOLUTION: The manufacturing method includes a step in which a metal layer formed on a support base material by vacuum sputtering or vacuum evaporation is transferred to the resin composition layer containing the resin component. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011187488(A) 申请公布日期 2011.09.22
申请号 JP20100048093 申请日期 2010.03.04
申请人 SUMITOMO BAKELITE CO LTD 发明人 CHUMA TOSHIAKI;KAGIMOTO TOMOHIRO
分类号 H05K1/14;H01L21/60;H05K3/34 主分类号 H05K1/14
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