发明名称 |
METHOD FOR MANUFACTURING CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTING TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a conductive connecting material having a laminate structure of a resin composition layer containing a resin component and a metal layer, which enables excellent electric connection between connecting terminals opposing each other and high insulation reliability between adjacent terminals. SOLUTION: The manufacturing method includes a step in which a metal layer formed on a support base material by vacuum sputtering or vacuum evaporation is transferred to the resin composition layer containing the resin component. COPYRIGHT: (C)2011,JPO&INPIT |
申请公布号 |
JP2011187488(A) |
申请公布日期 |
2011.09.22 |
申请号 |
JP20100048093 |
申请日期 |
2010.03.04 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
CHUMA TOSHIAKI;KAGIMOTO TOMOHIRO |
分类号 |
H05K1/14;H01L21/60;H05K3/34 |
主分类号 |
H05K1/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|