| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of forming the semiconductor device including a semiconductor chip and a base plate without deteriorating a production yield. SOLUTION: The manufacturing method includes a step for pasting a plurality of base plates 16 having the semiconductor chips 13 mounted thereon to a support film 18 at a predetermined space, a step for forming a sealing resin 17 on the lower surface of the support film 18 so as to cover the base plates 16 and the semiconductor chips 13, a step for forming wiring patterns 15 on the lower surface of the sealing resin 17 so as to be electrically connected to the semiconductor chips 13, a step for forming a solder resist film 14 on the lower surface of the sealing resin 17 so that a part of the wiring patterns 15 is exposed, a step for forming BGA balls 12 on the wiring patterns 15 exposed from the solder resist film 14, a step for cutting the sealing resin 17 and the solder resist layer 14, and a step for peeling the base plates 16 and the semiconductor chips 13 which are covered with the sealing resin 17 from the support film 18. COPYRIGHT: (C)2011,JPO&INPIT
|
