发明名称 SOLDER RETURN FOR WAVE SOLDER NOZZLE
摘要 A solder return apparatus (100) for a wave solder machine that (10) collects solder exiting a nozzle and returns the solder to a solder reservoir (24) while limiting the degree to which the solder can splash onto electronic substrates (e.g., printed circuit boards), components of the wave solder machine, and/or the like. The apparatus includes a mounting (114) section that may be placed over an upper surface of the nozzle and a collection section (116) that collects the solder and returns the solder to the solder reservoir (24). The collection section (116) includes a trough (126) having an opening (140) in a bottom wall of the trough and a flow control member (144) that can adjust a quantity of solder exiting the trough as well as the velocity of the solder exiting the trough. One or more deflection plates (156) can be mounted so as to extend from the trough into solder in the solder reservoir to further contain the solder and limit the degree to which splashing solder can reach unintended locations.
申请公布号 WO2011116093(A2) 申请公布日期 2011.09.22
申请号 WO2011US28664 申请日期 2011.03.16
申请人 FLEXTRONICS AP, LLC;YANAROS, LARRY;WAGNER, FREDERICK 发明人 YANAROS, LARRY;WAGNER, FREDERICK
分类号 B23K1/08;B23K3/06;H05K3/34 主分类号 B23K1/08
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