发明名称 ION IMPLANTATION APPARATUS, ION IMPLANTATION METHOD, AND SEMICONDUCTOR DEVICE
摘要 <p>In the plasma-based ion implantation for accelerating positive ions of a plasma and implanting the positive ions into a substrate to be processed on a holding stage in a processing chamber where the plasma has been excited, ion implantation is achieved in the following manner: an RF power having a frequency of 4 MHz or greater is applied to the holding stage to cause a self-bias voltage to generate on the surface of the substrate. The RF power is applied a plurality of times in the form of pulses.</p>
申请公布号 KR20110104509(A) 申请公布日期 2011.09.22
申请号 KR20117015027 申请日期 2009.12.10
申请人 NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY 发明人 OHMI TADAHIRO;GOTO TETSUYA
分类号 H01J37/317;H01L21/265 主分类号 H01J37/317
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