PRINTED CIRCUIT BOARD AND METHOD FOR PRODUCING SAME

摘要

The disclosed printed circuit board is provided with: a substrate unit (4) to which an electronic component (12) is to be mounted, and that has a plate-shaped insulating base material (9) and a conductive pattern (10) formed on at least one surface of said insulating base material (9) and connected directly or indirectly to the aforementioned electronic component (12) via a lead line (15); a metal heat sink (2) that overlaps the other surface of the aforementioned insulating base material (9); and a heat transmission pathway that thermally connects the aforementioned electronic component (12) and the aforementioned heat sink (2); and the aforementioned heat transmission pathway is a metal pin (3) that is bonded and affixed to said heat sink (2) and attached to the aforementioned electronic component (12).