| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing method for an electronic component and use of the same, which is excellent in adhesiveness of constituent members formed of plastic material. SOLUTION: The sealing method for an electronic component includes a coating process for coating a basic catalyst A on mutually-opposed surfaces of a case 1a and a base 1b, which face to each other; and a curing process for curing an epoxy resin composition B by contacting the epoxy resin composition B with the basic catalyst A coated on the opposed surfaces. COPYRIGHT: (C)2011,JPO&INPIT |
