| 摘要 |
A coplanar line formed on a high-frequency substrate of a high-frequency module includes a first dielectric layer, a signal line which is formed on the surface of the first dielectric layer and connected to a core line of a coaxial connector, a ground which is formed in opposite areas beside the signal line with a clearance therebetween, and a lower ground of the first dielectric layer. A second dielectric layer is laminated with the first dielectric layer so as to interpose the lower ground therebetween. Additionally, the lower ground is exposed on the terminal face of the high-frequency substrate coupled with the coaxial connector in either the first dielectric layer or the second dielectric layer and connected to an outer conductor of the coaxial connector. Thus, it is possible to prevent an insertion loss from increasing due to electromagnetic emission occurring in the clearance of the high-frequency substrate in response to transmitting signals in a high frequency range.
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