发明名称 METHOD OF FABRICATING HYBRID IMPACT-IONIZATION SEMICONDUCTOR DEVICE
摘要 The present disclosure provides a semiconductor device which includes a semiconductor substrate, a first gate structure disposed over the substrate, the first gate structure including a first gate electrode of a first conductivity type, a second gate structure disposed over the substrate and proximate the first gate structure, the second gate structure including a second gate electrode of a second conductivity type different from the first conductivity type, a first doped region of the first conductivity type disposed in the substrate, the first doped region including a first lightly doped region aligned with a side of the first gate structure, and a second doped region of the second conductivity type disposed in the substrate, the second doped region including a second lightly doped region aligned with a side of the second gate structure.
申请公布号 US2011227161(A1) 申请公布日期 2011.09.22
申请号 US20100725081 申请日期 2010.03.16
申请人 TAIWAN SEMICONDUCTOR MENUFACTURING COMPANY, LTD. 发明人 ZHU MING;TEO LEE-WEE;CHUANG HARRY HAK-LAY
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
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