发明名称 CHIP THROUGH FLOORING MATERIAL USING PLA RESIN
摘要 Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin comprises: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.
申请公布号 WO2011115382(A2) 申请公布日期 2011.09.22
申请号 WO2011KR01559 申请日期 2011.03.07
申请人 LG HAUSYS, LTD.;HUANG, CHENG-ZHE;KIM, JI-YOUNG;PARK, KI-BONG;KANG, CHANG-WON;KWON, JUN-HYUK;KWON, HYUN-JONG;PARK, SANG-SUN;KIM, JANG-KI;LEE, GYEONG-MIN 发明人 HUANG, CHENG-ZHE;KIM, JI-YOUNG;PARK, KI-BONG;KANG, CHANG-WON;KWON, JUN-HYUK;KWON, HYUN-JONG;PARK, SANG-SUN;KIM, JANG-KI;LEE, GYEONG-MIN
分类号 B32B21/08;B32B21/02;B32B27/18 主分类号 B32B21/08
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