| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid sealing resin composition having high Tg as a thermosetting resin obtained by a heat treatment, low elasticity and excellent strength and deflection. SOLUTION: The liquid sealing resin composition for semiconductor contains as essential components, (A) an epoxy silicone resin expressed by general formula (1), having 50-100,000 cPa viscosity at room temperature and 15-2,000 g/eq epoxy equivalent, (B) a compound and a resin liquid at room temperature and having at least one or more acid anhydride groups or amino groups and (C) a curing accelerator. In formula, each of R<SB>1</SB>and R<SB>2</SB>expresses hydrocarbon group, E<SB>1</SB>expresses epoxy group-containing group having epoxy group to be bonded via a group containing isocyanuric ring skeleton, Z expresses bivalent organic group, and (m) and (n) independently express 0-100. COPYRIGHT: (C)2011,JPO&INPIT |
