| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a semiconductor device, which can suppress adherence of fragments or the like caused by dicing, thereby improving reliability and a yield rate of the semiconductor device. SOLUTION: The method for manufacturing a semiconductor device by dicing a semiconductor wafer where a plurality of elements are formed includes the steps of: reforming or processing boundary regions of the plurality of elements of the semiconductor wafer; fixing the semiconductor wafer to one surface of a sheet member which is planarly larger than the semiconductor wafer and has elasticity; supporting an end of the sheet member to which the semiconductor wafer is fixed; and adjusting pressure so that a first pressure on the side of the sheet member having the supported end where the semiconductor wafer is fixed is higher than a second pressure on the side where the semiconductor wafer is not fixed, thereby elastically bending in a concave manner the sheet member and the semiconductor wafer on the side where the semiconductor wafer is fixed, and dicing the semiconductor wafer into individual pieces. COPYRIGHT: (C)2011,JPO&INPIT |
