发明名称 LASER BEAM MACHINING APPARATUS, AND LASER BEAM MACHINING METHOD
摘要 PROBLEM TO BE SOLVED: To perform the laser beam machining of an object to be machined (hereinafter called as a workpiece) even when a part of the workpiece is chipped. SOLUTION: A laser beam machining apparatus includes a laser beam source for emitting laser beam, a holding stand for holding the workpiece, an optical system causing the laser beam emitted from the laser beam source to be incident on the workpiece held on the holding stand, an imaging apparatus for imaging an image of the workpiece held on the holding stand, and a control device which determines the scanning range of the laser beam on the workpiece based on the profile of the workpiece with its image being imaged by the imaging apparatus so as not to reach a chipped portion if the workpiece has any chipped portion, and which controls the operation of at least one of the optical system and the holding stand so that the laser beam is incident on the scanning range. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011183404(A) 申请公布日期 2011.09.22
申请号 JP20100048042 申请日期 2010.03.04
申请人 SUMITOMO HEAVY IND LTD 发明人 HAMADA SHIRO
分类号 B23K26/00;B23K26/03 主分类号 B23K26/00
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