| 摘要 |
PROBLEM TO BE SOLVED: To reduce the depth dimension of a device in a coating and developing system for performing a process to form an antireflection film on a substrate, a process to form a resist film thereon, and a process to carry out developing on a substrate after exposure. SOLUTION: A COT layer B4 for forming the resist film on the substrate, a BCT layer B5 for forming the antireflection film underlying the resist film, a TCT layer B3 for forming the antireflection film overlying the resist film, and DEV layers B1 and B2 for carrying out developing processing are mutually laminated. A delivery stage group laminated with delivery stages corresponding to each layer is provided in the front and rear of these laminates. Thus, the substrate can be delivered between respective layers via the delivery stage. Further, a protective film formation unit for forming a protective film to immersion exposure on the surface of the substrate is provided on any of the COT layer B4, the BCT layer B5 and TCT layer B3. COPYRIGHT: (C)2011,JPO&INPIT |
