| 摘要 |
A MEMS device manufacturing method including a break start point forming step of forming a break start point in a substrate along the areas corresponding to a plurality of crossing streets set on the substrate before forming a plurality of MEMS devices on the substrate, a device forming step of forming the MEMS devices in a plurality of areas partitioned by the areas corresponding to the crossing streets on the front side of the substrate after performing the break start point forming step, and a substrate breaking step of applying an external force to the substrate after performing the device forming step to thereby break the substrate along the areas corresponding to the crossing streets where the break start point is formed, thus dividing the substrate into the individual MEMS devices.
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