| 摘要 |
A first metal layer is deposited on each microsystem (6) and on an annular zone of an adhesion layer surrounding each microsystem, so as to completely cover each microsystem by overlap. A second metal layer (9) is electrolytically deposited on the first metal layer and on the adhesion layer so as to cover the first layer over most of its surface leaving at least one passage per microsystem in the second layer to provide access to the first metal layer. A first metal layer is deposited on each microsystem (6) and on an annular zone of an adhesion layer surrounding each microsystem, so as to completely cover each microsystem by overlap. A second metal layer (9) is electrolytically deposited on the first metal layer and on the adhesion layer so as to cover the first layer over most of its surface leaving at least one passage per microsystem in the second layer to provide access to the first metal layer. The metal of the first layer is different from the metals of the adhesion layer, the second layer and the microsystem. The first layer is removed by selective chemical etching through each passage of the second layer. The passages are then closed to obtain metal capsules hermetically enclosing each microsystem. |
