Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.
申请公布号
EP2366692(A2)
申请公布日期
2011.09.21
申请号
EP20110158231
申请日期
2011.03.15
申请人
ROHM AND HAAS ELECTRONIC MATERIALS LLC
发明人
NIAZIMBETOVA, ZUKHRA L.;NAJJAR, ELIE H.;RZEZNIK, MARIA ANNA;REDDINGTON, ERIK