| 摘要 |
<p>The component has a semiconductor chip base (21) including balls (29) fixed to a front face of the component, and a resin protection layer (43) having thickness lower than height of the balls. Grooves (53) extend in the protection layer between the balls. The thickness of the protection layer is 40 and 70 percent of height of the balls. Size of the balls is 0.25 to 0.35 mm. A cut-stop layer is arranged between the protection layer and the front face of the component. An independent claim is also included for a method for fabrication of a surface mount electronic component.</p> |
