发明名称 Sensor package having shaped lead frame
摘要 A sensor assembly includes a lead frame having a recessed portion with a recess face, and an electrical component that is disposed in the recessed portion. The electrical component can be a capacitor, a resistor, or a coil.
申请公布号 EP2366976(A1) 申请公布日期 2011.09.21
申请号 EP20100156894 申请日期 2010.03.18
申请人 NXP B.V. 发明人 OFFERMANN, BERND
分类号 G01D5/14;G01D11/24 主分类号 G01D5/14
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