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经营范围
发明名称
Sensor package having shaped lead frame
摘要
A sensor assembly includes a lead frame having a recessed portion with a recess face, and an electrical component that is disposed in the recessed portion. The electrical component can be a capacitor, a resistor, or a coil.
申请公布号
EP2366976(A1)
申请公布日期
2011.09.21
申请号
EP20100156894
申请日期
2010.03.18
申请人
NXP B.V.
发明人
OFFERMANN, BERND
分类号
G01D5/14;G01D11/24
主分类号
G01D5/14
代理机构
代理人
主权项
地址
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