Method for manufacturing ultrasonic sensor, ultrasonic sensor, and banknote handling apparatus comprising ultrasonic sensor

摘要

According to one embodiment, a method for manufacturing an ultrasonic sensor includes forming a first conductive layer (632a) on one side of a piezoelectric body (631) having opposing sides; forming a second conductive layer (632b) on the other side of the piezoelectric body (631); forming a backing layer (640) on the first conductive layer (632a); forming a matching layer (610) of a size corresponding to a size of a conveyed object to be detected on the second conductive layer; and providing at least one incision (G) that cuts through the first conductive layer (632a), the piezoelectric body (631), the second conductive layer (632b) and the matching layer (610), the incisions (G) having a depth extending from the matching layer (610) to at least the first conductive layer (632a), to form a plurality of channels (C).