| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal core multilayer printed wiring board in which mounting density is high, heat dissipation and mass productivity are superior, and reliability is high. SOLUTION: The metal core multilayer printed wiring board has at least a five-layer structure wherein a conductor layer includes a metal core 111. A through conduction hole 101 penetrates the direction of thickness of the wiring board and electrically connects optional conductor layers by copper plating 141 for connection to an optional conductor layer. The copper plating of the through conduction hole is connected with the metal core, and the periphery of the through conduction hole of the metal core is separated from the metal core other than itself, by a notch hole that is formed to partition the periphery of the through conduction hole from its peripheral metal core body and is filled with an insulating material of an inner insulation layer, and by a non-conduction hole that penetrates the inner conductors 112 and 113, inner insulation layers 121 and 122 and metal core and is filled with the insulating material of the outer insulation layers 123 and 124, thus forming another circuit electrically. COPYRIGHT: (C)2008,JPO&INPIT |
