| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board adapted to decrease interfacial stress generated between different materials that form insulation and wiring layers while securing excellent electrical conductivity to the obviate delamination of the insulation and wiring layers and also the generation of cracks. SOLUTION: The circuit board is formed with insulation layers and wiring layers and characterized in that at least one wiring layer is formed of a metal part and comprises a first interface region that contacts an insulation layer and a second interface region that that may contact or not contact with the insulation layer, wherein the first interface region is formed of a porous metal having greater porosity than an intermediate region in the thickness direction or the second interface region has. COPYRIGHT: (C)2006,JPO&NCIPI |
