| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a polyimide film which can form a polyimide film which is excellent in heat resistance and rigidity suitable for a substrate film of an electronic component, does not cause the inconvenience owing to curling even when various functional layers are laminated while it is heated, and is excellent in heat deformation stability. SOLUTION: The method for manufacturing the polyimide film is characterized by introducing a both faces drying process in which a precursor film released from a substrate is dried from both faces to dry a solvent, between a first drying process in which a precursor polyamic acid film is manufactured on the substrate, and a process in which imidation reaction is performed by reacting the film by heat. COPYRIGHT: (C)2007,JPO&INPIT |
