发明名称 FUNCTIONAL CAPPING
摘要 A wafer level method of making a micro-electronic and/or micro-mechanic device, having a capping with electrical wafer through connections (vias), comprising the steps of providing a first wafer of a semiconductor material having a first and a second side and a plurality of holes and/or recesses in the first side, and a barrier structure extending over the wafer on the second side, said barrier comprising an inner layer an insulating material, such as oxide, and an outer layer of another material. Then, metal is applied in said holes so as to cover the walls in the holes and the bottom of the holes. The barrier structure is removed and contacts are provided to the wafer through connections on the back-side of the wafer. Bonding structures are provided on either of said first side or the second side of the wafer. The wafer is bonded to another wafer carrying electronic and micro-electronic/mechanic components, such that the first wafer forms a capping structure covering the second wafer. Finally the wafer is singulated to individual devices.
申请公布号 EP2365934(A1) 申请公布日期 2011.09.21
申请号 EP20090827830 申请日期 2009.11.19
申请人 SILEX MICROSYSTEMS AB 发明人 EBEFORS, THORBJOERN;KAELVESTEN, EDVARD;BAUER, THOMAS
分类号 B81C1/00;B81B7/00;H01L21/50;H01L23/48 主分类号 B81C1/00
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