发明名称 CHIP THROUGH FLOORING MATERIAL USING POLYLACTIC ACID RESIN
摘要 Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.
申请公布号 KR20110103809(A) 申请公布日期 2011.09.21
申请号 KR20100023052 申请日期 2010.03.15
申请人 LG HAUSYS, LTD. 发明人 HUANG, CHENG ZHE;KIM, JI YOUNG;PARK, KI BONG;KANG, CHANG WON;KWON, JUN HYUK;KWON, HYUN JONG;PARK, SANG SUN;KIM, JANG KI;LEE, GYEONG MIN
分类号 B32B21/08;B32B21/02;B32B27/18 主分类号 B32B21/08
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