发明名称 Housing for power semiconductor modules
摘要 The housing has side walls with a main frame (120) and locating frames (130). The main frame has guides (122,128) for receiving connection members (30,32) with connection tabs (310,320) that lie parallel to a substrate of the housing. The locating frames lie on the connection tabs to prevent movement of the connection members in the direction of the substrate. An Independent claim is included for a circuit device.
申请公布号 EP1429385(B1) 申请公布日期 2011.09.21
申请号 EP20030027136 申请日期 2003.11.26
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG 发明人 KRONEDER, CHRISTIAN
分类号 H01L23/053;H01L23/08;H01L23/498;H01L25/07;H01L25/18 主分类号 H01L23/053
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