发明名称 |
Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility |
摘要 |
In one aspect, a method is provided for electronic device manufacturing. The method includes receiving a request to transfer a carrier to or from a first substrate loading station of an electronic device manufacturing facility, and assigning one of a plurality of carrier supports to carry out the transfer based on a spacing on either side of the assigned carrier being greater than an acceptable spacing. Numerous other aspects are provided.
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申请公布号 |
US8024065(B2) |
申请公布日期 |
2011.09.20 |
申请号 |
US20080244004 |
申请日期 |
2008.10.02 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BRILL TODD J.;TEFERRA MICHAEL;PURI AMITABH;JESSOP DANIEL R.;WARNER GLADE L.;DUFFIN DAVID C. |
分类号 |
G06F7/00;B24B5/00;B65G47/10;H01L21/00;H01L21/677 |
主分类号 |
G06F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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