| 摘要 |
An apparatus that evaluates a layout of a semiconductor integrated circuit by estimating a result of planarization in manufacturing the circuit includes a unit that divides the layout into partial areas, a unit that calculates, for each partial area, at least one of a wiring density in the partial area, a total perimeter length of wirings in the partial area, and a maximum value of differences of wiring densities in adjacent partial areas adjacent to the partial area from the wiring density in the partial area as partial area data, a unit that sets ranges of the wiring density, the total perimeter length, and the maximum value from which a height variation larger than an upper limit value is expected as critical regions based on an equation corresponding to a type of the layout, and a unit that plots the critical regions and the partial area data on a same map.
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