| 摘要 |
An LED illuminating device includes an optical module and a heat dissipation device. The optical module includes a plurality of LEDs. The heat dissipation device includes a housing and a heat sink. The heat sink includes a base and a plurality of spaced fins formed on the base. The LEDs are thermally attached to a heat absorbing surface formed at a bottom of a bottom plate of the housing. The heat sink and the housing cooperatively define a hermetical chamber therebetween. A closed sidewall of the chamber is sandwiched between the base of the heat sink and the bottom plate of the housing. A wick structure is received in the chamber and attached to the heat dissipation device at a periphery of the chamber. A working fluid is filled in the chamber and saturated in the wick structure.
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