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发明名称
Rotary type polishing apparatus for wafer
摘要
申请公布号
KR101065166(B1)
申请公布日期
2011.09.16
申请号
KR20090085820
申请日期
2009.09.11
申请人
发明人
分类号
H01L21/304
主分类号
H01L21/304
代理机构
代理人
主权项
地址
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