| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a test method thereof, for achieving a high-speed test at a desired operating frequency. SOLUTION: An SiP 101 includes a logic chip 103A and a memory chip 103B. The memory chip 103B includes a memory circuit to be tested.The logic chip 103A includes an internal logic circuit 20 and a test processing circuit 21 electrically connected thereto. The test processing circuit 21 is connected with an access terminal of the memory circuit to test the memory circuit by supplying a test signal input from an external terminal 23n. The test processing circuit 21 has a high-speed test control circuit for adjusting a signal delay, and supplies in the high-speed test at an actual operating speed, the test signal supplied from the external terminal 23n to the access terminal through the high-speed test control circuit. COPYRIGHT: (C)2011,JPO&INPIT
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