发明名称 RESIN COMPOSITION AND FORMED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a resin composition capable of providing a formed article capable of heightening surface smoothness when laminated on a member having holes or unevenness on the surface, and to provide the formed article. SOLUTION: The resin composition contains an epoxy resin, a cyanate compound, a first silica having an average particle diameter of≥0.1μm and≤10μm, and a second silica having an average particle diameter of≥1 nm and <100 nm. The formed article is obtained by forming the resin composition into a sheet shape. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011178858(A) 申请公布日期 2011.09.15
申请号 JP20100043243 申请日期 2010.02.26
申请人 SEKISUI CHEM CO LTD 发明人 HAYASHI TATSUJI;UENISHI SHOTA;DEGUCHI HIDEHIRO;YOKOTA REONA;TOTTORI DAISUKE
分类号 C08L63/00;C08G59/40;C08K3/36;C08K5/315 主分类号 C08L63/00
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