| 摘要 |
According to one embodiment, a package substrate design device includes a first wiring module, a net generator, a second wiring module, and a third wiring module. The first wiring module is configured to generate a plurality of first vias configured to connect wires on the first wiring layer and wires on the second wiring layer and configured to generate a plurality of first wires configured to connect the first vias and the first terminals. The net generator is configured to generate nets for connecting the second terminals and k-th (k is an integer of 1 to (n−2)) vias. The second wiring module is configured to generate a plurality of (k+1)-th vias configured to connect wires on the (k+1)-th wiring layer and wires on the (k+2)-th wiring layer and configured to generate a plurality of (k+1)-th wires configured to connect the (k+1)-th vias and the k-th vias, the (k+1)-th vias and the (k+1)-th wires being generated between the k-th vias and the second terminals connected by the nets. The third wiring module is configured to generate a plurality of n-th wires configured to connect the (n−1)-th vias and the second terminals.
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