发明名称 CHARGE BREAKDOWN AVOIDANCE FOR MIM ELEMENTS IN SOI BASE TECHNOLOGY AND METHOD
摘要 A semiconductor device including at least one capacitor formed in wiring levels on a silicon-on-insulator (SOI) substrate, wherein the at least one capacitor is coupled to an active layer of the SOI substrate. A method of fabricating a semiconductor structure includes forming an SOI substrate, forming a BOX layer over the SOI substrate, and forming at least one capacitor in wiring levels on the BOX layer, wherein the at least one capacitor is coupled to an active layer of the SOI substrate.
申请公布号 US2011221030(A1) 申请公布日期 2011.09.15
申请号 US201113116416 申请日期 2011.05.26
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CLARK, JR. WILLIAM F.;LUCE STEPHEN E.
分类号 H01L29/06 主分类号 H01L29/06
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