| 摘要 |
<p>An ultrasonic probe, an ultrasonic imaging apparatus and a fabricating method thereof are provided. The ultrasonic probe includes a rear block having a predetermined thickness, a flexible printed circuit board stacked on the rear block to surround the top face and side of the rear block and having wiring patterns formed thereon, a piezoelectric wafer stacked on the top face of the flexible printed circuit board and having upper and lower electrodes respectively formed on both sides thereof and a plurality of second holes formed therein, a ground electrode plate stacked on the top face of the piezoelectric wafer, bonded to the upper electrode and connected to a ground layer of the flexible printed circuit board, an acoustic matching layer stacked on the top face of the ground electrode plate, an acoustic lens bonded onto the acoustic matching layer, and a plurality of slots formed in the direction perpendicular to the second holes and ranging from in the acoustic matching layer to the top of the rear block. Holes are formed in at least one of the rear block, the piezoelectric wafer and the acoustic matching layer and wiring patterns are formed in the form of a matrix array, and thus vibration property and focusing can be improved to obtain clear images.</p> |
