| 摘要 |
A semiconductor assembly package includes a package unit, a shielding layer and a protection layer. The package unit includes a semiconductor assembly, a daughter substrate and a mold compound. The semiconductor assembly is disposed on and electrically connected to the daughter substrate. The daughter substrate includes a metal portion grounded. The mold compound encapsulates the semiconductor assembly and the daughter substrate to expose the metal portion out of the package unit. The shielding layer is applied to the package unit and electrically connected to the metal portion, to provide electromagnetic shielding for the semiconductor assembly. The non-conductive protection layer is covered on the shielding layer.
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