| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a contactless IC card which can suppress deformation of a transmitting/receiving antenna due to heating and pressurizing steps for reducing unevenness of a card surface and which is less in the increase of manufacturing cost, in comparison with conventional methods. <P>SOLUTION: An adhesive layer pattern 4 which is constituted of a thermosetting resin is formed on a surface of a core sheet base material 1, by printing or applying and the adhesive layer pattern 4 is hardened; and then an IC module 5 provided with a contactless communication function and a transmitting/receiving antenna 6 are installed on the core-sheet base material 1; and subsequently, oversheets 2 and 3 are placed thereon and under the core-sheet base material and are heated and pressurized. The adhesive layer pattern 4 is constituted of a linear pattern, disposed along a planar coil-like pattern of the transmitting/receiving antenna 6. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
