发明名称 HEAD NOZZLE UNIT, AND APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a head nozzle unit allowing a series of mounting processes of suction of an electronic component of a pair of head nozzle parts and mounting of the sucked electronic component to be sequentially performed crosswise with each other. <P>SOLUTION: This head nozzle unit includes a pair of motion guides 210, 220 disposed in parallel to each other, a pair of movable blocks 310, 320 respectively disposed on the pair of motion guides and movable independently of each other, a guide member 400 transversely connected to the pair of motion guides via the pair of movable blocks, a pair of head nozzle parts 510, 520 respectively disposed on both side parts of the guide member to be movable independently of each other to suck and mount an electronic component, and a drive portion 600 that interlocks the pair of movable blocks with the pair of head nozzle parts along a predetermined direction. The apparatus and the method for mounting electronic components are also provided. Thereby, a series of mounting processes of suction of the electronic component and mounting of the sucked electronic component of the pair of head nozzles can be crosswise and sequentially performed. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011181933(A) 申请公布日期 2011.09.15
申请号 JP20110043578 申请日期 2011.03.01
申请人 SAMSUNG TECHWIN CO LTD 发明人 LEE TAE-YOUNG;CHOI BOO-GOAN
分类号 H05K13/04 主分类号 H05K13/04
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