| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin film deposition device capable of depositing a thin film in a uniform film thickness by uniformly discharging a thin film material vapor from a plurality of places different from one another. SOLUTION: A discharge device 20 disposed in a vacuum chamber 11 has one or more-than-one discharge units 20a, each discharge unit 20a has a discharge vessel 21a which is hollow and has a longitudinal direction, two or more introduction pipes 31a1 to 31a3 are disposed in the discharge vessel 21a along the longitudinal direction of the discharge vessel 21a so as to be positioned at different distances from a discharge port 25a and introduction ports 35a1 to 35a3 provided to the different introduction pipes 31a1 to 31a3 are formed so as to be positioned in different places in the longitudinal direction. Vapor discharge mount from each discharge port 25a can be made uniform by controlling vapor supply speed to each introduction tube 31a1 to 31a3. COPYRIGHT: (C)2011,JPO&INPIT
|
