| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that the cracks and deposition failures of plating, which are caused by such a current method used in forming a double-sided circuit and a multilayer circuit, for a printed board that through-holes are drilled into a printed board and plated and then connected to a conductive circuit on each layer with plating for interlayer conductive connections. SOLUTION: An electrical connecting method to upper and lower layers of a conductive circuit board includes steps of forming a conductive circuit 3 with aperture in a fibrous base material 1 with aperture, and bending the conductive circuit 3 up- and down-ward in order to carry out electrical connection to another conductive circuit 5 or to electronic parts 11 of the upper and lower layers. COPYRIGHT: (C)2011,JPO&INPIT
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