| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink which has high flatness such that a semiconductor attachment surface of the heat sink is hardly scratched and a semiconductor element is brought into close contact as much as possible in a stage of transporting a plurality of heat sinks having been processed together, with respect to the heat sink and a method of transporting the heat sink. SOLUTION: The heat sink has a base formed by extrusion molding or drawing, the semiconductor attachment surface provided on one surface of the base and fitted with the semiconductor element, and protective projections which protrude from the semiconductor attachment surface toward the semiconductor element and are formed at two opposite sides of a rectangle defining the semiconductor attachment surface, wherein one of the protective projections has a projection rib which further protrudes and the other has a recessed groove conforming with the projection rib. COPYRIGHT: (C)2011,JPO&INPIT
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