| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure which has a brazing joint structure employing an aluminum-based plated steel plate as a raw material of a shock absorbing material, the heat dissipation structure having, in particular, durability to thermal shock. SOLUTION: A method of manufacturing a heat dissipation structure for mounting a semiconductor heating component is provided by which, when the heat dissipation structure for mounting the semiconductor heating component is manufactured by brazing and joining an insulating substrate 2, the aluminum-based plated steel plate 3, and a heat transfer material 4 together, brazing filler metal 5 and 6 are interposed between an aluminum-based metal layer A of the insulating substrate 2 and the aluminum-based plated steel plate 3, and between the aluminum-based plated steel plate 3 and heat transfer material 4 respectively, and brazing is carried out in a state wherein an interfacial exposed part 7 between a ceramic plate 21 and the aluminum-based metal layer A is coated with a heat-resisting coating 8 which does not react with molten metal of the brazing filler metal. COPYRIGHT: (C)2011,JPO&INPIT
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