| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated electronic component by which a structural defect such as a crack after baking is suppressed and a short-circuit failure can be prevented. SOLUTION: A method for manufacturing a laminated electronic component includes steps of: forming a plurality of laminate units having a green sheet 20, an electrode pattern 30 and a margin pattern 40; and laminating the laminate units. In the lamination step, a differenceΔSz between a surface roughness Sz1 of a first surface 40a and a surface roughness Sz2 of a second surface 20a is 0.60-1.60μm while Sz1 and Sz2 are measured by a noncontact system where the first surface 40a is a surface of the margin pattern of the first laminate unit, and is a surface in contact with a surface of the green sheet of the second laminate unit, and the second surface 20a is a surface of the green sheet of the second laminate unit, and is a surface in contact with a surface of the margin pattern of the first laminate unit. COPYRIGHT: (C)2011,JPO&INPIT
|
